OIF Boosts AI with Multi-Vendor Demo at ECOC 2025 Copenhagen

ByRicardo

OIF highlights how interoperability permits scalable, AI-era networks by way of Market Focus classes and reside demos

OIF, collectively with 35 taking part member firms, is shaping the way forward for AI-era networks by demonstrating how multi-vendor collaboration delivers real-world interoperability and permits the size, pace, and effectivity that tomorrow’s networks demand at ECOC 2025 Exhibition, going down from September 29 to October 1 in Copenhagen, Denmark.

Interoperability in Action

OIF’s reside demonstration at sales space #C3425 unites member firms throughout the ecosystem to show that the constructing blocks of the long run — optical, electrical, administration and power environment friendly interfaces — are prepared for deployment. Showcasing interoperability in a fancy, real-world surroundings, the demonstration highlights applied sciences together with 400ZR, 800ZR, Multi-Span Optics, Common Electrical I/O (CEI) CEI-448G, CEI-224G, CEI-112G, Co-Packaging, Common Management Interface Specification (CMIS), Energy Efficient Interfaces (EEI) and extra — illustrating how requirements allow networks to scale for AI and data-intensive purposes.

800ZR, 400ZR and Multi-Span Optics – Optical Breakthroughs: Better Than Before

This demonstration will current the newest developments in interoperability for pluggable coherent optics, offering an intensive overview of their options and purposes. The single-span demo highlights embody 800ZR multivendor interop between modules utilizing 5 totally different DSPs alongside the foundational OIF 400ZR utility. For multi-span connectivity, the demonstration will function OpenZR+, 100ZR and 800G OpenROADM throughout a number of community infrastructures.

CEI-448G, 224G and 112G – Driving Innovation and Collaboration for Future-Oriented Data Centers

At ECOC, OIF will showcase interoperability and innovation at {the electrical} interface with 448G and 224G CEI demonstrations that span the total spectrum of next-generation connectivity. The 448G demo focuses on hyperscaler wants for scaling AI networks, whereas expanded CEI-224G showcases deliver larger ecosystem participation and spotlight numerous hyperlink varieties from Very Short Reach (VSR) to Long Reach (LR) and Linear. In collaboration with the EEI observe, OIF can even display energy-efficient electro-optical innovation throughout retimed, half-retimed (RTLR) and unretimed (Linear) pluggable optics. These demonstrations spotlight the power of the CEI ecosystem, proving strong interoperability throughout distributors and hyperlink varieties whereas advancing scalable, high-performance connectivity.

EEI and Co-Packaging – Revolutionizing Connectivity

OIF members will current achievements enabling power environment friendly electrical and optical interfaces with each reside and conceptual demonstrations of next-generation EEI options for AI compute, alongside with reside External Laser Small Form-Factor Pluggable (ELSFP) demos highlighting developments in exterior laser sources crucial for co-packaged optics architectures. Addressing power effectivity is likely one of the highest-priority challenges confronted by hyperscalers as they develop their AI sources to the following era.

As a part of this yr’s demonstration, CMIS will run inside a reside, simulated community surroundings somewhat than as a standalone setup — underscoring the specification’s maturity and its position in enabling seamless, plug-and-play integration throughout disaggregated methods.

These member firms — system distributors, part and module suppliers, check and measurement suppliers, semiconductor and digital design automation (EDA) firms, and main connector and cabling producers — are taking part within the demo: 1Finity, Adtran, Alphawave Semi, Amphenol, Anritsu Corporation, AOI, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, Furukawa FITEL, HGGenuine, Juniper Networks (now a part of HPE), Keysight Technologies, Lessengers, Ligent, Inc., Lumentum, Marvell, MaxLinear Inc., Molex, MultiLane, Nokia, Nubis Communications, O-Net, Samtec, SENKO Advanced Components, Sumitomo Electric Industries, Synopsys, Inc., Terahop PTE Ltd., TE Connectivity, US Conec and Wilder Technologies.

“Interoperability isn’t an summary promise — it’s a market enabler,” stated Nathan Tracy, OIF President (TE Connectivity). “By bringing these numerous applied sciences/challenges collectively beneath one roof, OIF is accelerating adoption, lowering dangers and enabling operators, hyperscalers and distributors to maneuver quicker in addressing surging AI demand.”

Setting the Agenda at ECOC Market Focus

Beyond the exhibit ground, OIF leaders will ship well timed views throughout ECOC’s Market Focus program, providing actionable insights into the forces reshaping networks:

  • Coherent Technology Advances within the Market, DCI Interop and Shorter Reaches for AI

Date: Tuesday, Sept. 30

Time: 12:20–12:35pm CEST

Presenter: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair

  • CMIS – The Interface that Ties Everything Together for AI

Date: Tuesday, Sept. 30

Time: 2:20–2:35pm CEST

Presenter: Ian Alderdice, OIF Physical & Link Layer Working Group Management Co-Vice Chair (Ciena)

  • Energy Efficiency in AI Applications – Making Sense of the Multiple Requirements

Date: Wednesday, Oct. 1

Time: 10:40–10:55am CEST

Presenter: Jeff Hutchins, OIF Board Member and Secretary/Treasurer, Physical & Link Layer Working Group Energy Efficient Interfaces Vice Chair (Ranovus)

  • 448G Architectures For AI – Addressing the Challenges, Enabling the Future

Date: Wednesday, Oct. 1

Time: 12:00–12:15pm CEST

Presenter: Mike Klempa, OIF Board Member and Physical & Link Layer Interoperability Working Group Chair (Alphawave Semi)

The publish OIF Boosts AI with Multi-Vendor Demo at ECOC 2025 Copenhagen first appeared on AI-Tech Park.

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